Japan Laser Processing Society (JLPS), Journal of Laser Micro/Nanoengineering, 2(10), p. 148-153, 2015
DOI: 10.2961/jlmn.2015.02.0007
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Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.