Accurate driver and package models are necessary to analyze the signal integrity (SI) and electromagnetic compatibility (EMC) issues on digital circuits. 2-pole models that assume an ideal power distribution system (PDS) are commonly used in modeling the SI of signal lines. This assumption makes real SI and EMC analysis worthless or at least only useful under certain restrictions. In order to account for all current return paths, the power and ground lines have to be considered as well. As such, the driver and the package is modeled as a 3-pole and a 6-pole network, respectively.