Published in
Springer (part of Springer Nature), Journal of Electronic Materials, 6(37), p. 777-791
DOI: 10.1007/s11664-008-0409-4
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Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures
Journal article published in 2008 by
T.-S. Park,
M. Dao 
,
S. Suresh,
A. J. Rosakis,
D. Pantuso,
S. Shankar
,
S. Suresh,
A. J. Rosakis,
D. Pantuso,
S. Shankar
This paper is available in a repository.
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