ZrO2, HfO2 and DyScO3 thin films having thickness in the range 2-20 nm were grown on SiOx/Si(100) substrates in a multi-wafer planetary MOCVD reactor combined with a liquid delivery system using engineered precursors. Growth rate, surface morphology, crystal structure, crystal density of the as-deposited films were analysed as a function of deposition temperature. The influence of post deposition annealing on the densification and crystallization was studied. Electrical properties of MIS capacitor structures are also discussed. Results on the optimised gate stack of Pt/ZrO2/SiOx/Si, Pt/HfO2/SiOx/Si, Pt/DyScO3/SiOx/Si are finally compared; and DyScO3 seems to be promising high-k material candidate compared to Group-IVB oxides for the coming technology nodes.