Published in

Elsevier, Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1-4(191), p. 346-351

DOI: 10.1016/s0168-583x(02)00532-3

Links

Tools

Export citation

Search in Google Scholar

Artificial ion tracks in volcanic dark mica simulating natural radiation damage: A scanning force microscopy study

Journal article published in 2002 by M. Lang, U. A. Glasmacher, B. Moine ORCID, C. Muller, R. Neumann, G. A. Wagner
This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Red circle
Postprint: archiving forbidden
Red circle
Published version: archiving forbidden
Data provided by SHERPA/RoMEO

Abstract

A new dating technique uses alpha-recoil tracks (ART), formed by the natural alpha-decay of U, Th and their daughter products, to determine the formation age of Quaternary volcanic rocks (<10(6) a). Visualization of etched ART by scanning force microscopy (SFM) enables to access track densities beyond 10(8) cm(-2) arid thus extend the new ART-dating technique to an age range 10(6) a. In order to simulate natural radiation damage, samples of phlogopite, originating from Quaternary and Tertiary volcanic rocks of the Eifel (Germany) and Kerguelen Islands (Indian Ocean) were irradiated with U, Ni (11.4 MeV/u), Xe, Cr, Ne (1.4 MeV/u) and Bi (200 keV) ions. After irradiation and etching with HF at various etching times, phlogopite surfaces were visualized by SFM. Hexagonal etch pits are typical of U, Xe and Cr ion tracks, but the etch pits of Ni, Ne and Bi ion tracks are triangular. Surfaces irradiated with U, Xe, Cr and Ni ions do not show any significant difference between etch pit density arid irradiation fluence, whereas the Ne-irradiated surface show similar to14 times less etch pit density. The etching rate upsilon(H) (parallel to cleavage) depends on the chemical composition of the phlogopite. The etching rate v'(T) (along the track) increases with energy loss. (C) 2002 Published by Elsevier Science B.V.