Published in
Springer (part of Springer Nature), Journal of Electronic Materials, 6(32), p. 558-563
DOI: 10.1007/s11664-003-0142-y
Links
Tools
Optimization of black oxide coating thickness as an adhesion promoter for copper substrate in plastic integrated-circuit packages
Journal article published in 2003 by
Mohamed Lebbai,
Jang-Kyo Kim 
,
W. K. Szeto,
Matthew M. F. Yuen,
Pin Tong
,
W. K. Szeto,
Matthew M. F. Yuen,
Pin Tong
This paper is available in a repository.
Full text: Download
Published version:
archiving forbidden
Data provided by 