ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 2004
DOI: 10.31399/asm.cp.istfa2004p0566
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Abstract Building a portfolio of deformations is the key step for building better defect models for the test and yield learning domain. A viable approach to achieve this goal is through geometric characterization and classification of failure patterns found on memory fail bitmaps. In this paper, we present preliminary results on how to build such a portfolio of deformations for an IC technology of interest based on a fail bitmap analysis study conducted on large, modern SRAM memory products.