In order to carry out a study of wafer patterning, equipment was developed for safe handling of silicon wafers from 2 to 8 inch diameters. The unit can be safely and relatively straightforwardly operated by personnel, using a wide range of etchants and electrochemical deposition processes. The design also allows the effects of electrolyte flowrate in the process chamber confronting the silicon wafer, to be assessed. These features were utilised to study copper and nickel electrodeposition to pattern the wafer surface.