Published in
The 17th Annual SEMI/IEEE ASMC 2006 Conference
DOI: 10.1109/asmc.2006.1638759
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Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology
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Abstract
The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage