The 17th Annual SEMI/IEEE ASMC 2006 Conference
DOI: 10.1109/asmc.2006.1638759
Full text: Unavailable
The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage