Published in
American Institute of Physics, Journal of Applied Physics, 8(118), p. 085501
DOI: 10.1063/1.4928855
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Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics
Journal article published in 2015 by
A. Bulusu 
,
A. Singh,
C. Y. Wang,
A. Dindar,
C. Fuentes Hernandez,
H. Kim,
D. Cullen ,
B. Kippelen,
S. Graham
,
A. Singh,
C. Y. Wang,
A. Dindar,
C. Fuentes Hernandez,
H. Kim,
D. Cullen ,
B. Kippelen,
S. Graham
This paper is made freely available by the publisher.
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