Electroless plating is a facile wet-chemical process for the creation of metal thin films on arbitrary substrates, which can be used to produce intricate nanomaterials. In this study, we demonstrate how nanotubes and nanowires can be electrolessly deposited in the rhombohedral pores of ion-track etched muscovite mica templates. Mutual optimization of the activation and plating reactions proved to be essential for the fabrication of well-defined nanostructures of an aspect ratio (length-to-diameter) of up to approx. 70. By repeating the activation procedure utilizing the redox couple Sn(II) and Ag(I), a high density of Ag nanoparticle seeds could be deposited on the template surface, which was required to initiate metal film nucleation with nanoscale homogeneity. Furthermore, it was necessary to adapt the plating reaction to ensure sufficient diffusion of the reagents into the depth of the template pores. To prove the flexibility of the process and to evaluate the effect of the intrinsic film morphology on the shape of the resulting nanostructures, three different plating reactions were applied (Ag, Au, Pt). If the size of the deposited metal particles approached the dimension of the template pores, only wire-like structures of moderate shape conformity were obtained. Electroless plating protocols which yield homogeneous deposits consisting of small nanoparticles allowed exact replication of the pore shape. Under consideration of the above-mentioned requirements, electroless plating displays an effective and versatile route towards the fabrication of parallel arrays of angular metal nanotubes and nanowires in the chemically and thermally robust mica templates. By simply immersing the templates in aqueous plating solutions for an appropriate time, well-defined metal nanomaterials for application in e.g. plasmonics, catalysis or molecular separation are obtained.