Published in

American Association for the Advancement of Science, Science, 5638(301), p. 1357-1359, 2003

DOI: 10.1126/science.1086636

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A Maximum in the Strength of Nanocrystalline Copper

Journal article published in 2003 by Jakob Schiøtz ORCID, Karsten W. Jacobsen
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

We used molecular dynamics simulations with system sizes up to 100 million atoms to simulate plastic deformation of nanocrystalline copper. By varying the grain size between 5 and 50 nanometers, we show that the flow stress and thus the strength exhibit a maximum at a grain size of 10 to 15 nanometers. This maximum is because of a shift in the microscopic deformation mechanism from dislocation-mediated plasticity in the coarse-grained material to grain boundary sliding in the nanocrystalline region. The simulations allow us to observe the mechanisms behind the grain-size dependence of the strength of polycrystalline metals.