Published in
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
DOI: 10.1109/ectc.2014.6897495
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Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
Proceedings article published in 2014 by
C. S. Wong,
A. Ivankovic,
A. Cowley 
,
N. S. Bennett,
A. N. Danilewsky,
M. Gonzalez,
V. Cherman,
B. Vandevelde,
I. De Wolf,
P. J. McNally
,
N. S. Bennett,
A. N. Danilewsky,
M. Gonzalez,
V. Cherman,
B. Vandevelde,
I. De Wolf,
P. J. McNally
This paper is available in a repository.
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