For gate insulator of amorphous InGaZnO thin-film transistor, we fabricated fluorinated silicon nitride (SiN:F) film formed by an inductively-coupled plasma enhanced chemical vapor deposition method by utilizing SiF4/N2 as source gases. Threshold voltage shift against electrical stress was successfully suppressed. Chemical analysis revealed that the hydrogen concentration was reduced to 1/10 of conventional SiN film and fluorine was introduced into the interface between the SiN:F film and channel layer. We conclude that the decrease of hydrogen content and introduction of fluorine lead to decrease of electron trap density at the interface and/or the SiN:F film.