A novel PIFA model with multiple shorting pins is proposed for multiband, low profile wireless applications, which has the ability to work in adverse conditions. The proposed model has a planar radiating sheet, a ground plane, and sides covered with PEC boundaries. The substrate inside the antenna box is tempered in order to improve the bandwidth and gain. The enhancements applied to the proposed PIFA model show improved characteristics for this PIFA model and make it a versatile candidate for handheld, low profile, and multiband resonant communication devices. Pertinent communication devices are those that work with GSM 850/900, UMTS 850/900/1700/1900/2100, LTE 2300/2500, and ISM 2400 bands used for Bluetooth and WLAN.