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American Institute of Physics, Applied Physics Letters, 19(102), p. 192107

DOI: 10.1063/1.4807125

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Monolithic integration of light-emitting diodes and power metal-oxide-semiconductor channel high-electron-mobility transistors for light-emitting power integrated circuits in GaN on sapphire substrate

Journal article published in 2013 by Z. Li, J. Waldron, T. Detchprohm ORCID, C. Wetzel ORCID, R. F. Karlicek, T. P. Chow
This paper is available in a repository.
This paper is available in a repository.

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Abstract

We report the demonstration of monolithically integrated light-emitting diodes (LEDs) and power metal-oxide-semiconductor channel high-electron-mobility transistors (HEMTs) in GaN. The structure comprised a direct epitaxial integration of layers typical for a GaN-based LED grown directly on top of the layers of a GaN-based HEMT. The layers were then fabricated into a serially connected pair of GaN LED and metal-oxide-semiconductor-gated 0.3 mu m-channel HEMT by exposing the LED/HEMT epitaxial layers in selective area etching. The resulting monolithically integrated circuit shows a full gate voltage modulation of the light output power. This demonstrates compatibility of group-III nitride LED and HEMT processes. (C) 2013 AIP Publishing LLC.