Published in

Institute of Electrical and Electronics Engineers, IEEE Transactions on Electron Devices, 8(57), p. 1978-1986, 2010

DOI: 10.1109/ted.2010.2050836

Links

Tools

Export citation

Search in Google Scholar

Modeling Issues and Performance Analysis of High-Speed Interconnects Based on a Bundle of SWCNT

Journal article published in 2010 by Alessandro Giustiniani, Vincenzo Tucci ORCID, Walter Zamboni ORCID
This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Green circle
Postprint: archiving allowed
Red circle
Published version: archiving forbidden
Data provided by SHERPA/RoMEO

Abstract

The effects of the uncertainties associated with the transverse pattern of carbon nanotubes (CNTs) of the conducting type in a semiglobal interconnect based on a densely packed CNT bundle are investigated. The effectiveness of the insertion of a variable number of repeaters along the interconnect and the influence of the contact resistances between CNTs and external circuitry are also studied. The numerical computations are performed by using a multiconductor transmission line model in which the per-unit length parameters are accurately derived from a macroscopic fluidlike description of the conduction phenomena in CNTs.