Published in

Institute of Electrical and Electronics Engineers, IEEE Electron Device Letters, 9(29), p. 1001-1003, 2008

DOI: 10.1109/led.2008.2002075

Links

Tools

Export citation

Search in Google Scholar

Electromigration studies of Cu/carbon nanotube composite interconnects using Blech structure

Journal article published in 2008 by Philip C. H. Chan, Yunyi Fu, Yang; Chan Philip C. H.; Fu Yunyi; Chuang Y. C.; Liu C. Yang Chai ORCID, Y. C. Chuang, C. Y. Liu
This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Upload
Green circle
Postprint: archiving allowed
Upload
Red circle
Published version: archiving forbidden
Policy details
Data provided by SHERPA/RoMEO

Abstract

The electromigration (EM) properties of pure Cu and Cu/carbon nanotube (CNT) composites were studied using the Blech test structure. Pure Cu and Cu/CNT composite segments were subjected to a current density of 1.2 x 10(6) A/cm(2). The average void growth