Published in
2008 2nd Electronics Systemintegration Technology Conference
DOI: 10.1109/estc.2008.4684509
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MicroLens/UV-LED array packaging for dynamic and static alignment
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Abstract
This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120degC.