Self-assembled monolayers of ω-(4′-methyl-biphenyl-4-yl)-dodecyl thiol [CH3–C6H4-C6H4–(CH2)12–SH,BP12] on gold were patterned via exposure to 300 eV electrons. Subsequent copper deposition in an electrochemical cell revealed behavior opposite to that of electron beam patterned monolayers of alkanethiols. Whereas alkanethiols act as a positive resist and lead to copper deposition only on irradiated parts, the biphenyl based thiol acts as a negative resist. At the irradiated areas the layer exhibits blocking behavior and copper deposition is observed only on the nonirradiated parts. © 2001 American Institute of Physics.