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Wiley, Advanced Materials, 48(21), p. 4970-4974, 2009

DOI: 10.1002/adma.200902101

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Nanometer‐Thick Single‐Crystal Hexagonal Gd<sub>2</sub>O<sub>3</sub> on GaN for Advanced Complementary Metal‐Oxide‐Semiconductor Technology

This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

(Figure Presented) Hexagonal-phase single-crystal Cd2O 3 is deposited on CaN in a molecular beam epitaxy system (see image). The dielectric constant is about twice that of its cubic counterpart when deposited on InGaAs or Si. The capacitive effective thickness of 0.5 nm in hexagonal Gd2O3 is perhaps the lowest on GaN-metal-oxide-semiconductor devices. The heterostructure is thermodynamically stable at high temperatures and exhibits low interfacial densities of states after high-temperature annealing.