The XPAD3 chip bump-bonded to a Si sensor has been widely used in preclinical microcomputedtomography and in synchrotron experiments. Although the XPAD3 chip is linear up to60 keV, the performance of the XPAD3/Si hybrid detector is limited to energies below 30 keV, forwhich detection efficiencies remain above 20%. To overcome this limitation on detection efficiencyin order to access imaging at higher energies, we decided to develop a camera based on XPAD3single chips bump-bonded to high-Z CdTe sensors. We will first present the construction of this newcamera, from the first tests of the single chip hybrids to the actual mechanical assembly. Then, wewill show first images and stability tests performed on the D2AM beam line at ESRF synchrotronfacility with the fully assembled camera.