Adhesion of epoxy resins on copper foils for printed circuit board (PCB) applications is improved by nearly a factor of 5, using surface cleaning and deposition of a 15-nm-thick film in a low-pressure remote plasma-enhanced chemical vapor deposition process. The cleaning pretreatment, using an N2–O2 oxidizing gas mixture with moderate heating (343 K), gives the best results. This pretreatment removes the carbonaceous contaminants present on the topmost surface of the sample and slightly oxidizes the copper into CuO. This oxide is then reduced during the deposition treatment, presumably by reaction with the aminopropyltrimethoxysilane (APTMS) precursor. The surface roughness is unchanged after treatment, thereby showing that the improvement of the copper/epoxy adhesion is only due to the chemistry of the plasma coating. Applying these results to dielectric barrier discharges allows us to achieve the same level of adhesion, which, therefore, does not depend on the process.