The Electrochemical Society, ECS Transactions, 1(34), p. 473-478, 2011
DOI: 10.1149/1.3567622
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Thin LuxAl2−xO3 films were deposited by atomic-layer deposition using Lu(thd)3, and TMA in combination with O3 as oxidizer. High-quality dielectric films were obtained with good process con-trol. The full range of the Lu/(Lu+Al) composition was found to be accessible. The films showed bulk density and low roughness. As a result, this process enables the study of LuxAl2−xO3 as dielectric in advanced non-volatile memory devices.