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Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII

DOI: 10.1117/12.905758

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Direct investigation of the ablation rate evolution during laser drilling of high aspect ratio micro-holes

This paper is available in a repository.
This paper is available in a repository.

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Abstract

The recent development of ultrafast laser ablation technology in precision micromachining has dramatically increased the demand for reliable and real-time detection systems to characterize the material removal process. In particular, the laser percussion drilling of metals is lacking of non-invasive techniques able to monitor into the depth the spatial-and time-dependent evolution all through the ablation process. To understand the physical interaction between bulk material and high-energy light beam, accurate in-situ measurements of process parameters such as the penetration depth and the removal rate are crucial. We report on direct real time measurements of the ablation front displacement and the removal rate during ultrafast laser percussion drilling of metals by implementing a contactless sensing technique based on optical feedback interferometry. High aspect ratio micro-holes were drilled onto steel plates with different thermal properties (AISI 1095 and AISI 301) and Aluminum samples using 120-ps/110-kHz pulses delivered by a microchip laser fiber amplifier. Percussion drilling experiments have been performed by coaxially aligning the diode laser probe beam with the ablating laser. The displacement of the penetration front was instantaneously measured during the process with a resolution of 0.41 mu m by analyzing the sawtooth-like induced modulation of the interferometric signal out of the detector system.