IOP Publishing, Journal of Micromechanics and Microengineering, 5(22), p. 055025
DOI: 10.1088/0960-1317/22/5/055025
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This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding tool. The efficient placement and alignment functions of the wire-bonding tool are used to mechanically attach the wire to deep-etched silicon anchoring and clamping structures. This approach enables a reliable and accurate integration of wire materials that cannot be wire bonded by traditional means. ; QC 20120528