Links

Tools

Export citation

Search in Google Scholar

Correlation among crystalline morphology of PEEK, interface bond strength, and in-plane mechanical properties of carbon/PEEK composites

Journal article published in 2002 by Sl Gao, Jang-Kyo Kim ORCID
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

Full text: Unavailable

Question mark in circle
Preprint: policy unknown
Question mark in circle
Postprint: policy unknown
Question mark in circle
Published version: policy unknown

Abstract

The effect of the cooling rate on in-plane and interlaminar properties of carbon fiber/semicrystalline PEEK matrix composites was studied. Strengths and moduli were measured in tension, flexure, and interlaminar shear, all of which were shown to correlate, to different degrees, with the fiber-matrix interface adhesion and the bulk matrix properties, The in-plane and interlaminar properties, in general, increased with a decreasing cooling rate, which was attributed to changes in the failure mechanism from adhesive failure involving fiber-matrix interface debonding at high cooling rates to matrix-dominant cohesive failure at low cooling rates. The present study demonstrates that the mechanical properties of semicrystalline thermoplastic composites can be tailored for desired applications by controlling the processing conditions, especially the cooling rate. (C) 2002 Wiley Periodicals, Inc.