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Electronic cooling of a submicron-sized metallic beam

Journal article published in 2009 by J. T. Muhonen, Antti O. Niskanen, M. Meschke, Y.-U. A. Pashkin ORCID, J. S. Tsai, L. Sainiemi, S. Franssila, Jukka P. Pekola
This paper is available in a repository.
This paper is available in a repository.

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Abstract

We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metaltunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures. ; Peer reviewed