Published in

ECS Meeting Abstracts, 34(MA2012-02), p. 2738-2738, 2012

DOI: 10.1149/ma2012-02/34/2738

Elsevier, Electrochimica Acta, (78), p. 524-531

DOI: 10.1016/j.electacta.2012.06.076

Links

Tools

Export citation

Search in Google Scholar

Multi-scale modeling of direct copper plating on resistive non-copper substrates

Journal article published in 2012 by Liu Yang, Aleksandar Radisic, Magi Margalit Nagar, Johan Deconinck ORCID, Leonardus Leunissen, Philippe M. Vereecken, Alan C. West
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

Full text: Download

Green circle
Preprint: archiving allowed
Upload
Green circle
Postprint: archiving allowed
Upload
Red circle
Published version: archiving forbidden
Policy details
Data provided by SHERPA/RoMEO

Abstract

Abstract not Available.