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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
DOI: 10.1109/polytr.2001.973285
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Reliability of different flex materials in high density flip chip on flex applications
Journal article published in 1970 by
Ieee,
Y. De Maquille,
P. Palm,
J. Maattanen,
A. Picault,
Jan Vanfleteren 
,
Bjorn Vandecasteele
,
Bjorn Vandecasteele
This paper is available in a repository.
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