Published in

Elsevier, LWT - Food Science and Technology, 2(63), p. 1076-1082, 2015

DOI: 10.1016/j.lwt.2015.04.027

Links

Tools

Export citation

Search in Google Scholar

Dielectric Barrier Discharge Atmospheric Air Plasma Treatment of High Amylose Corn Starch Films

This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Green circle
Postprint: archiving allowed
Green circle
Published version: archiving allowed
Data provided by SHERPA/RoMEO

Abstract

Atmospheric dielectric barrier discharge plasma is a novel non-thermal technology for food decontamination. The effects of dielectric barrier discharge plasma on the surface topography, thermal behavior, chemical composition and water vapor permeability of high amylose corn starch films have been examined. Plasma treatment significantly increased the surface roughness of the starch films. Thermal degradation profiles of all the starch films were similar, although a decrease in the maximum degradation temperature was observed after plasma treatment. X-ray photoelectron spectroscopy and Fourier transform Infrared spectra confirmed the increase in surface oxygen content and appearance of new O=C–O groups on the film surface after plasma treatment at 70 and 80 kV for 5 minutes. X-ray diffraction showed the A-type crystal structure which was not affected by plasma treatment. Surface hydrophilicity was also found higher after cold plasma treatment. Although, no significant change in the water vapor permeability was observed. The evaluation of plasma induced changes in the biodegradable polymers shows the compatibility of two environmentally-friendly strategies in food technology: cold plasma decontamination of food packaged with biodegradable materials.