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Lee et al., 2005
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@misc{Lee2005, abstract = {기계공학전공}, author = {Lee, Sb Lee Soon-Bok and Paik, Kw and Jeon, Yd and Yang, Sy and Kwon, Ym}, month = {jan}, title = {A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs}, year = {2005} }
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A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs
Published in 2005 by
Sb Lee Soon-Bok Lee
,
Kw Paik
,
Yd Jeon
,
Sy Yang
,
Ym Kwon
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
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Abstract
기계공학전공