Published in
American Chemical Society, ACS Applied Electronic Materials, 5(6), p. 3545-3553, 2024
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The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding
Journal article published in 2024 by
Yu Zhang 
,
Ziqi Lian,
Fei Ding,
Anqi Zhou,
Renxi Jin,
Yudong Yang,
Qidong Wang
,
Ziqi Lian,
Fei Ding,
Anqi Zhou,
Renxi Jin,
Yudong Yang,
Qidong Wang
This paper was not found in any repository, but could be made available legally by the author.
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- Must obtain written permission from Editor
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