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Springer, Journal of Electronic Materials, 7(52), p. 4614-4625, 2023

DOI: 10.1007/s11664-023-10402-0

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A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Journal article published in 2023 by R. Rakhmat Kurniawan, Biju Theruvil Sayed ORCID, Arif Sari, Jorge Paucar Luna, A. K. Kareem, Naseer Ali Hussien
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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