High-strength, high-conductivity copper/silver-alloyed materials were prepared by cold-spray (CS) manufacturing. For DC high-field application at room temperature, bulk Cu/Ag (5% vol. Ag) alloys with high mechanical properties and high electrical conductivity can be obtained by CS and post-heat treatments. For pulsed-field application at liquid nitrogen temperature, bulk Cu/Ag (5% vol. Ag) alloys serve as precursors for room-temperature wire drawing. The Cu/Ag-alloyed bulk CS deposit presents a high yield strength of about 510 MPa with a corresponding electrical resistivity of 1.92 µΩ·cm (at 293 K). The Cu/Ag-alloyed wires show a very high ultimate tensile strength (1660 MPa at 77 K or 1370 MPa at 293 K) and low electrical resistivity (1.05 µΩ·cm at 77 K or 2.56 µΩ·cm at 293 K). Microstructural studies via STEM allow us to understand this very high level of mechanical strength. The results evidence that materials developed by CS exhibit very high mechanical properties compared to materials prepared by other routes, due to the high velocity of the deposited particles, which leads to high initial deformation rates and specific microstructural features.