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Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances

Journal article published in 2010 by Olivier Dubreuil, Véronique Caubet-Hilloutou, Julie Guillan, Katia Haxaire, Maxime Mellier, Pierre Caubet, Patricia Vannier, Emmanuel Petitprez, Daniel Bellet ORCID, Ph Normandon
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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