AbstractThe structure of nanomaterials and nanodevices determines their functionality and applications. A single uniform nanochannel with a high aspect ratio is an attractive structure due to its unique rigid structures, easy preparation, and diverse pore structures and it holds significant promising importance in fields such as nanopore sensing and nanomanufacturing. Although the metal‐nanoparticle‐assistant silicon etching technique can produce uniform nanochannels, however, the fabrication of single through nanochannels remains a challenge thus far. A simple and versatile strategy is developed that allows for the retention of individual gold nanoparticle on a substrate, enabling single‐nanoparticle nanomachining. This method involves three steps: the formation of a carbon protective layer on individual nanoparticles via electron‐beam irradiation, selective removal of unprotected nanoparticles using a corrosive agent, and subsequent elimination of the carbon layer. This enables the fabrication of a single submillimeter‐long uniform through nanochannel in the silicon wafer, which can be employed for nanopore sensing and shape‐based nanoparticle distinguishing. The developed method can also facilitate single‐nanoparticle studies and nanomachining for a broad application in materials science, electronics, micro/nano‐optics, and catalysis.