Dissemin is shutting down on January 1st, 2025

Published in

IOP Publishing, Superconductor Science and Technology, 6(37), p. 065005, 2024

DOI: 10.1088/1361-6668/ad3f83

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An open-source 3D FE quench simulation tool for no-insulation HTS pancake coils

This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Data provided by SHERPA/RoMEO

Abstract

Abstract A new module, Pancake3D, of the open-source finite element quench simulator (FiQuS) has been developed in order to perform transient simulations of no-insulation (NI) high-temperature superconducting pancake coils in three-dimensions. FiQuS/Pancake3D can perform magnetodynamic or coupled magneto-thermal simulations. Thanks to the use of thin shell approximations, an H → − ϕ formulation, and anisotropic homogenization techniques, each turn can be resolved on the mesh level in an efficient and robust manner. FiQuS/Pancake3D relies on pre-formulated finite-element (FE) formulations and numerical approaches that are programmatically adjusted based on a text input file. In this paper, the functionalities and capabilities of FiQuS/Pancake3D are presented. The challenges of FE simulation of NI coils and how FiQuS/Pancake3D addresses them are explained. To highlight the functionalities, the results of a magneto-thermal analysis of a double pancake coil with 40 turns per pancake with local degradation of the critical current density are conducted and discussed. Furthermore, a parameter sweep of the size of this local degradation is presented. All FiQuS input files for reproducing the simulations are provided.