Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics
Journal article published in 2023 by
Won Bae Han 
,
Gwan-Jin Ko,
Seung Min Yang ,
Heeseok Kang ,
Joong Hoon Lee ,
Jeong-Woong Shin ,
Tae-Min Jang ,
Sungkeun Han,
Dong-Je Kim,
Jun Hyeon Lim,
Kaveti Rajaram,
Amay Jairaj Bandodkar ,
Suk-Won Hwang
,
Gwan-Jin Ko,
Seung Min Yang ,
Heeseok Kang ,
Joong Hoon Lee ,
Jeong-Woong Shin ,
Tae-Min Jang ,
Sungkeun Han,
Dong-Je Kim,
Jun Hyeon Lim,
Kaveti Rajaram,
Amay Jairaj Bandodkar ,
Suk-Won Hwang
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