Published in
Elsevier, Scripta Materialia, (199), p. 113866, 2021
DOI: 10.1016/j.scriptamat.2021.113866
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The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers
Journal article published in 2021 by
A. V. Druzhinin 
,
C. Cancellieri ,
L. P. H. Jeurgens,
B. B. Straumal
,
C. Cancellieri ,
L. P. H. Jeurgens,
B. B. Straumal
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