Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Applied Superconductivity, 8(31), p. 1-5, 2021
DOI: 10.1109/tasc.2021.3094435
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Numerical Study of Encapsulated Joint Performance in Soldered-Stacked HTS Wires
Journal article published in 2021 by
Qian Gang,
Longbiao Wang 
,
Yingying Lv ,
Mingyang Wang ,
Zhuyong Li ,
Zhiyong Hong,
Zhijian Jin
,
Yingying Lv ,
Mingyang Wang ,
Zhuyong Li ,
Zhiyong Hong,
Zhijian Jin
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