Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 3(12), p. 462-468, 2022
DOI: 10.1109/tcpmt.2021.3104326
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Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation
Journal article published in 2022 by
Candice Thomas 
,
Jean Charbonnier ,
Arnaud Garnier,
Nicolas Bresson,
David Bouchu,
Stephane Moreau ,
Frederic Gustavo,
Maud Vinet
,
Jean Charbonnier ,
Arnaud Garnier,
Nicolas Bresson,
David Bouchu,
Stephane Moreau ,
Frederic Gustavo,
Maud Vinet
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