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American Institute of Physics, Journal of Applied Physics, 13(130), p. 135301, 2021

DOI: 10.1063/5.0063418

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Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects

Journal article published in 2021 by Ryan R. Gusley ORCID, Quintin Cumston ORCID, Kevin R. Coffey ORCID, Alan C. West ORCID, Katayun Barmak ORCID
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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