The European 3D Heterogeneous Integration Platform (e-BRAINS) – a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems Proceedings IMAPS Device Packaging Conference, Scottsdale, USA, March 2015
Dataset published in 2015 by
Peter Ramm,
Armin Klumpp,
Josef Weber,
Alan Mathewson,
Kafil M. Razeeb,
Reinhard Pufall
