Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 9(12), p. 1516-1525, 2022
DOI: 10.1109/tcpmt.2022.3197358
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Thermo-Mechanical Stability of Resin-Added Sintered Silver Joints Between Si Die and Ni-/Au-Electroplated Substrate
Journal article published in 2022 by
Zhentang Liang 
,
Hongyue Wang ,
Bin Zhou,
Guoyuan Li,
Zhenhai Chen,
Zhiwei Fu ,
Si Chen,
Xiaofeng Yang ,
Cheng Peng ,
Chuangmian Huang
,
Hongyue Wang ,
Bin Zhou,
Guoyuan Li,
Zhenhai Chen,
Zhiwei Fu ,
Si Chen,
Xiaofeng Yang ,
Cheng Peng ,
Chuangmian Huang
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