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Royal Society of Chemistry, Materials Advances, 24(4), p. 6621-6626, 2023

DOI: 10.1039/d3ma00565h

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Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Abstract

Rice-grain copper nanoparticles of 420 nm diameter was obtained after micro-coarsening treatment, resulting in a 52% increase in copper foil surface area and a 10-fold increase in peel strength.