Published in
2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021
DOI: 10.1109/icept52650.2021.9568057
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Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package
Proceedings article published in 2021 by
Wen Liu,
Jinhui Li,
Jinshan Liu 
,
Tao Wang,
Ao Zhong,
Guoping Zhang,
Qiang Liu,
Rong Sun,
Daquan Yu
,
Tao Wang,
Ao Zhong,
Guoping Zhang,
Qiang Liu,
Rong Sun,
Daquan Yu
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