Published in
Royal Society of Chemistry, Nanoscale Advances, 20(4), p. 4263-4271, 2022
DOI: 10.1039/d2na00405d
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Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing
Journal article published in 2022 by
Dongdong Liu,
Zhenyu Zhang 
,
Jiajian Feng,
Zhibin Yu,
Fanning Meng,
Guanghong Xu,
Jianmei Wang,
Wei Wen,
Wei Liu
,
Jiajian Feng,
Zhibin Yu,
Fanning Meng,
Guanghong Xu,
Jianmei Wang,
Wei Wen,
Wei Liu
This paper is made freely available by the publisher.
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Abstract
Schematic diagram of chemical mechanical polishing on oxygen-free copper: (a) the pristine surface prior to CMP, (b) the chemical reaction, (c) mechanical removal and (d) atomic-level ultra-smooth surface after CMP.