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MDPI, Electronics, 17(12), p. 3589, 2023

DOI: 10.3390/electronics12173589

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High-Density Pixel Imaging Sensor Readout Electronics for Space Applications: A Design Overview

Journal article published in 2023 by Massimo Minuti, Carmelo Sgrò, Luca Baldini, Ronaldo Bellazzini, Alessandro Brez, Simone Castellano, Niccolo Di Lalla ORCID, Luca Latronico, Simone Maldera ORCID, Alberto Manfreda, Melissa Pesce-Rollins, Gloria Spandre, Mattia Barbanera, Saverio Citraro, Leonardo Lucchesi and other authors.
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Abstract

With the specialization of VLSI ASICs for front-end signal processing electronics, the customization of the control back-end electronics (BEE) has become critical to fully deploy the ASIC performance. In the context of space operations, with typical constraints on power and reliability, the design and qualification of such integrated systems present significant challenges. In this paper, we review the design and performance of the BEE systems after two years of operations in low Earth orbit (LEO); these systems read out the custom ASICs inside the gas pixel detectors, which are located at the heart of the imaging X-ray polarimetry explorer (IXPE), a NASA-ASI small explorer mission designed to measure X-ray polarization in the 2–8 keV energy range.