Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 8(11), p. 1177-1186, 2021
DOI: 10.1109/tcpmt.2021.3091555
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Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
Journal article published in 2021 by
Daniel Shoemaker 
,
Mohamadali Malakoutian,
Bikramjit Chatterjee ,
Yiwen Song ,
Samuel Kim ,
Brian M. Foley,
Samuel Graham ,
Christopher D. Nordquist ,
Srabanti Chowdhury ,
Sukwon Choi
,
Mohamadali Malakoutian,
Bikramjit Chatterjee ,
Yiwen Song ,
Samuel Kim ,
Brian M. Foley,
Samuel Graham ,
Christopher D. Nordquist ,
Srabanti Chowdhury ,
Sukwon Choi
This paper is made freely available by the publisher.
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